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  • Extended Depth-of-Field 3D Digital Microscope
Extended Depth-of-Field 3D Digital Microscope

Extended Depth-of-Field 3D Digital Microscope

  • Brand: HIKVISION
  • Model:DI-AM1160
  • Product description: The DI-AM1160 Extended Depth-of-Field 3D Digital Microscope supports 30×–6000× magnification with automated focusing, 2D/3D stitching and measurement. Suitable for industrial inspection, failure analy
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Extended Depth-of-Field 3D Digital Microscope_DI-AM1160

The DI-AM1160 Extended Depth-of-Field 3D Digital Microscope is a digital microscopy system designed for industrial inspection and research applications.

With a high-resolution telecentric optical imaging system and automated motion platform, the microscope supports high-magnification observation, automated focusing, and 3D surface analysis.

It is suitable for production inspection, failure analysis laboratories, academic research platforms, and inspection institutions.

Extended Depth-of-Field 3D Digital Microscope

Key Features

High-Resolution Telecentric Optical System

The microscope uses a telecentric optical imaging system providing 30× to 6000× magnification for detailed sample observation.

Multiple Illumination Modes

Supported illumination modes include:

· Brightfield coaxial illumination

· Brightfield oblique illumination

· Darkfield coaxial illumination

· Darkfield oblique illumination

· Mixed illumination

· Transmitted illumination

Brightness can be adjusted to suit different sample surfaces.

Detector Electrode (Darkfield Illumination, 2000×)

Detector Electrode (Darkfield Illumination, 2000×)

Detector Electrode (Brightfield Illumination, 2000×)

Detector Electrode (Brightfield Illumination, 2000×)


Fully Motorized System

The system integrates motorized control including:

· Motorized XY stage

· Motorized Z-axis focusing

· Motorized objective switching

· Motorized zoom control

This enables automated and repeatable microscopic observation.

Advanced Image Processing

Integrated image enhancement tools include:

· Auto focus

· HDR imaging

· Reflection reduction

· Halo reduction

· Super-resolution capture

· Image stabilization

Snap Fit Component (Original Image, 500×)

Snap Fit Component (Original Image, 500×)

Coin (Original Image, 50×)

Coin (Original Image, 50×)

Snap Fit Component (Reflection Reduction Enabled, 500×)

Snap Fit Component (Reflection Reduction Enabled, 500×)

Coin (Optical Shadow Mode, 50×)

Coin (Optical Shadow Mode, 50×)

Extended Depth-of-Field (EDF) Imaging:

The focus Z-axis drives the optical system to scan along the Z direction and synthesizes multiple focal planes to generate a fully focused image across the entire field of view.

PCB(超景深 50×)

PCB (Extended Depth-of-Field Imaging, 50×)
PCB(超景深 50×)-1

2D / 3D Image Stitching

For samples that require both high resolution and large-area observation, the 2D stitching function scans the sample across the XY stage over the defined stitching area and automatically merges the captured images into a single composite image. This enables the creation of ultra-large images with a maximum resolution of up to 5 billion pixels.


Typical Applications

超景深3D数码显微镜彩页--应用场景


Technical Specifications

Module Parameter Specification
Microscope Body Magnification Range

30×-6000×

(30×、40×、50×、80×、100×、150×、200×、300×、400× 、500×、700×、1000×、1500×、2000×、2500×、4000×、5000×、6000×)

Maximum Lateral Resolution

0.42 μm@6000×(Standard)(NA 0.8)

0.37 μm@6000×(Optional)(NA 0.9)
Maximum Working Distance 30mm
Maximum Sample Height 95mm
Maximum Extended Depth of Field 30mm
Illumination Modes
Brightfield (Coaxial / Oblique), Darkfield (Coaxial / Oblique), Mixed Illumination, Transmitted Illumination
Light Source LED,approx. 50,000 hours lifetime
Objective Switching Motorized
Zoom Control
Motorized
Maximum Observable Image Size
Up to 5 billion pixels; single direction <150,000 pixels (during 2D stitching)
Tilt Observation
−90° to +90°, single-hand operation with self-locking; precise mechanical lock at 0°
Medium XYθ Motorized Stage XY Stage Control

Motorized

Travel Range 40 mm × 40mm

Resolution

1 μm
θ Rotation Angle ±90°
Stage Size

228 mm × 205 mm

Central Circular Plate Φ 100 mm

Large XY Motorized Stage (Optional)


XY Stage Control Motorized
Travel Range 200 mm × 100mm (Reference)
Resolution 1 μm
θ Rotation Not Available
Stage Size
250 mm × 200 mm

Central Circular Plate Φ 170 mm

Focus Z-Axis

Control Mode Motorized
Travel Range 50 mm
Resolution 0.1 μm

Stage Z-Axis

Control Mode Motorized
Travel Range 50mm
Resolution 1 μm
Maximum Load Capacity 5 Kg


Module Function Specification
Observation Basic Microscopic Observation

Supported

Autofocus

Supported


Side View Observation

Supported

Illumination Switching

Brightfield (Coaxial / Oblique), Darkfield (Coaxial / Oblique), Mixed Illumination, Transmitted Illumination

Tilt Observation

Supported

Display Split Screen Display

Left/Right, Top/Bottom, 4-Screen, 9-Screen

Wide-Angle Display

Supported

Scroll Wheel Zoom 1x ~ 10x
Annotation YES

Image Processing

Reflection Reduction Brightness adjustable (0–100)
Halo Reduction Adjustable: Low / Medium / High
HDR Imaging Adjustable (0–100)
Super-Resolution Capture 12000 pixels × 9000 pixels
Optical Shadow Compensation

Supported

Image Stabilization

Supported

Image Stitching 2D Image Stitching Maximum size: up to 5 billion pixels; single direction <150,000 pixels
3D Image Stitching Maximum size: 50,000 × 50,000 pixels
Navigation

Supported

Registered Position Capture

Supported

3D Reconstruction 3D Reconstruction

Supported

High-Precision 3D Reconstruction

Supported

3D Visualization

Supported

3D Comparison

Supported

2D Measurement Distance / Angle / Area Measurement

Supported

Automatic Edge Detection

Supported

Scale Display

Supported

3D Measurement Point Brightness Analysis

Supported

Profile Measurement

Supported

Volume Measurement

Supported

Surface Roughness Measurement

Supported


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